QFN packages and I could not get on the same page. I made one prototype of the V1 design with TMC2209 drivers and only 3 out of 5 worked. I had to re-solder them 3 times just to get them to talk to the CPU. I was just thinking these are just hard on my aging hands and eyes.
I found countless YouTube videos of people soldering chips with QFN packages and it all seems so effortless. I thought I just suck at this.
Yesterday I made some driver board for the V2 design with the 2209 drivers and again had to re-solder the chips, followed the YouTube guides and no luck. Two would move the motors in very strange way and consume quite a bit of power and one plain would not move.
Here is one of the dreaded beasts
I was ready to give up, when I decided to check the driver datasheet for the recommended PCB land pattern. I thought maybe I’m missing something.
For background I downloaded a KiCAD footprint from somewhere and foolishly assumed since it was for Trinamic drivers, it should be correct. Oh well, lesson learned.
Turns out this chip has oversized exposure pad. It is so big that it would touch the pads for the pins on the PCB. It is very likely some of the pins on my board are just shorted to the ground via the die pad underneath.
This is the chip footprint I downloaded:
Looks pretty normal, except the center pad (29) is 3x3mm size. According to the TMC2209 datasheet, the pad on their chip is 3.7×3.7 mm size. Look what happens when I update the center pad size to match the datasheet:
The pin pads are almost connected to the center pad. I resized the pins to match the spec and this is the result
GRRR, All I have to say is “^@%$@^%$!”
I ordered a new set of driver boards with the fixed footprint.